Techsil is stocking TIA241GF silicone thermally conductive gap filler from Momentive, intended for applications where good heat transfer, low stress and good interface wetting are required. Thermal conductivity is 4.1W/mK.
Called TIA241GF, it offers tacky adhesion and retained softness after cure for applications where movements in x, y, and z directions occur due to vibration, thermal cycling stress and thermal mismatch. Flame retarding is UL94V-0 equivalent.
It is a two-part material (1:1 weight mix ratio) with non-slumping pasty consistency that can be used as liquid-dispensed alternative to pre-fabricated thermal pads, and there are 180 and 250µm glass beads option for bond thickness control. Vertical gaps up to 4mm can be bridged.
According to Techsil, it was initially proposed for automotive applications – electronic control units and systems – but can also be used as a thermal interface in consumer, telecommunication, lighting and industrial devices – filling multiple thickness gaps under single common heat sink is one use.
Post time: Oct-16-2024