Glass Beads for Gap Filler
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In all electronic applications, heat is lost during operation. In order to maintain the function of the components used in the long term, this heat must be dissipated. Gap fillers or gap filler pads are used for this purpose as Thermal Interface Materialien. They almost completely and permanently fill gaps caused by tolerances, differences in height or different expansion coefficients of the materials used in the electronic components. Depending on the application, either thermally conductive pads or corresponding pastes (fillers) are used. Both have a natural self-adhesion, which is why no additional bonding agents are required for adhesion in use. This makes them suitable for easy pre-assembly.
Gap-filling thermal compound is a two-part material (1:1 weight mix ratio) with non-slumping pasty consistency that can be used as liquid-dispensed alternative to pre-fabricated thermal pads, and there are 180 and 250µm glass bead option for bond thickness control. Vertical gaps up to 4mm can be bridged.